ZYGO 4104C Pulsed laser

ZYGO 4104C Today's recommended products: NVIDIA H100 PCIE NVIDIA H800 PCIE LAM 839-101612-885 LAM 839-101612-887 LAM 719-101612-885 LAM 719-101612-887 Many in stock, first come first served, first-hand source, channel Contact: Han Fangting Sales Manager Mobile :18030042035 QQ: 748141623 Email: 748141623@qq.com Web site :www.changxindcs.com www.changxinsz.com We operate ABB, GE aereration, A-B, Honeywell, KUKA, SCHNEIDER, Bentley, TRICONEX Invensys, WOODWARD, FOXBORO, WESTINGHOUSE, and MOTOROLA MOTOROLA, KEBA, KOLLMORGEN, EMERSON, HIMA dark horse, industrial and commercial energy storage, container energy storage, household light energy storage, (peak cutting, valley filling, backup power supply) can be contacted if necessary. Country of Origin: USA Moq :1 piece Packaging: new raw materials and individual packaging Delivery time :2-3 working days Payment method: Bank transfer, Western Union

ZYGO 4104C

ZYGO 4104C is a high performance pulsed laser, mainly used in the field of material processing. It uses advanced semiconductor pumping technology and is characterized by high energy density and stability. The laser can generate high-power pulsed laser, which is suitable for cutting, drilling, welding and other processing processes of various materials.

Product parameters and specifications:
Laser wavelength: usually 1064 nm (near infrared band), suitable for the processing of a variety of materials.
Peak power: up to several kilowatts, providing enough energy for material processing.
Repetition frequency: adjustable, the range is generally between 10 Hz and 200 Hz, can be adjusted according to different process requirements.
Pulse width: adjustable, the range is generally between 10 nanoseconds to 50 nanoseconds, can achieve different processing effects.
Beam quality: High beam quality to ensure machining accuracy.
Cooling method: forced air cooling or water cooling to ensure the stable operation of the laser.
Main functions:
Material processing: Used for metal, ceramics, plastics and other materials cutting, drilling, welding.


Micromachining: can be used to make micro devices and precision parts.
Surface treatment: can be used for surface modification, cleaning, etc.
Application field:
Electronic manufacturing: printed circuit board cutting, chip packaging, etc.
Automobile manufacturing: auto parts processing, welding.


Medical device: Micro medical device manufacturing.

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